| Cathode drum | Large-format titanium drum capability; reference drum size up to 3600 mm, surface roughness Ra ≤ 0.3 μm, runout / straightness control up to ±0.05 mm in applicable configurations. | Uniform copper deposition, stable foil formation and integration with high-current electro-deposition lines. | Foil width, thickness target, drum size, current, line speed, surface requirement and acceptance standard. |
| Anode cell & anode system | All-titanium arc cell structure, high-current operation and project-specific anode spacing; reference operating current up to 60 kA in certain copper foil equipment configurations. | Current distribution, stable electro-deposition environment and compatibility with cathode drum geometry. | Cathode drum diameter, anode gap, electrolyte composition, current plan, drawings and inspection requirements. |
| Copper dissolution system | Reference copper dissolution capacity up to 260 kg/h in applicable vertical tank configurations; continuous dissolution and circulation design. | Stable copper ion supply for continuous foil production and controlled electrolyte preparation. | Raw material form, copper concentration target, acid concentration, flow rate, temperature, site utilities and tank interface. |
| Surface treatment equipment | Continuous in-line washing, conditioning and post-treatment sections; modular multi-section line configuration. | Improve surface properties such as peel strength and oxidation resistance according to foil grade requirements. | Foil grade, line speed, surface treatment process route, module list, automation requirements and plant layout. |
| PET copper foil equipment | Project-defined equipment for composite film copper plating / PET copper foil-related processes. | Support new copper-coated film routes where substrate handling, plating uniformity and winding stability must be reviewed together. | Film substrate, target copper thickness, width, pretreatment route, plating bath data, winding and inspection requirements. |